Technical Papers
Measurement and Printability Studies
Repeatability
Edge Defects
Contacts
OPC
Soft Defects
Subwavelength Linewidth Measurement
Complete List in Chronological Order
Improved Method for Measuring and Assessing Reticle Pinhole Defects for the 100nm Lithography Node
By Darren Taylor, Photronics; and Anthony Vacca, Larry Zurbrick, KLA-Tencor. Presented at Photomask Japan 2002, April 2002.
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Mask Defect Disposition: Flux-Area Measurement of Edge, Contact, and OPC Defects Correlates to Wafer and Enables Effective Decisions
By Peter Fiekowsky, Automated Visual Inspection; Darren Taylor, Photronics; David Wang, C.C. Yang, S.C. Lin, PSMC Taiwan; and L.H. Tu, K.R. Lin, UMC Taiwan. Presented at Photomask Japan 2001, Paper 4409-10, April 2001.
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Contact Holes: Optical Area Measurement Predicts Printability and is Highly Repeatable
By Glen Scheid, LSI Logic Corp.; Darren Taylor, Photronics; and Peter Fiekowsky, Automated Visual Inspection. Presented at Photomask Japan 2001, Paper 4409-11, April 2001.
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New Optical Metrology for Masks: Range and Accuracy Rivals SEM
By Rand Cottle, Photronics; Peter Fiekowsky, Automated Visual Inspection; and C.C. Hung, S.C. Lin, TSMC Taiwan. Presented at Photomask Japan 2001, Poster 4409-60, April 2001.
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Feed Forward Modeling and Control on a Contact Masking Process
By G. W. Scheid, A. Kang, LSI Logic Corp.; Peter Fiekowsky, Automated Visual Inspection. Presented at the 26th Annual International Symposium on Microlithography, Paper 4344-103, March 2001.
Soft Defect Printability: Correlation to Optical Flux-Area Measurements
By Darren Taylor, Photronics and Peter Fiekowsky, Automated Visual Inspection. Presented at the SPIE 20th Annual BACUS Symposium on Photomask Technology and Management, Conference 4186, September 2000.
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Optical Reticle Metrology for Subwavelength Lithography
Published in Microlithography World, Spring 2000
The End of Thresholds: Subwavelength Optical Linewidth Measurement Using the Flux-Area Technique
By Peter Fiekowsky, Automated Visual Inspection. Presented at Photomask Japan 2000, Poster 4066-67, April 2000.
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Technique Brings More Certainty to Mask Measurements Published in Solid State Technology,Volume 42, Issue 4, October 1999
Defect Printability Measurement in the KLA-351: Correlation to Defect Sizing Using the AVI Metrology System
By Peter Fiekowsky, Automated Visual Inspection and Daniel Selassie, Intel Corporation. Presented at the SPIE 19th Annual BACUS Symposium on Photomask Technology and Management, Conference 3873, September 1999.
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Optical Measurement of Sub-0.5 Micron Defects and CDs
By Peter Fiekowsky, Automated Visual Inspection. Published in Bacus News, Volume 14, Issue 4, April 1998.
Accurate and Repeatable Mask Defect Measurements for Quarter-Micron Technology
By Peter Fiekowsky, Automated Visual Inspection. Presented at the SPIE 17th Annual BACUS Symposium on Photomask Technology and Management, September 1997.
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