Measurement and Printability Studies
Improved Method for Measuring and Assessing Reticle Pinhole Defects for the 100nm Lithography Node
By Darren Taylor, Photronics; and Anthony Vacca, Larry Zurbrick, KLA-Tencor. Presented at Photomask Japan 2002, April 2002.
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Mask Defect Disposition: Flux-Area Measurement of Edge, Contact, and OPC Defects Correlates to Wafer and Enables Effective Decisions
Contact Holes: Optical Area Measurement Predicts Printability and is Highly Repeatable
New Optical Metrology for Masks: Range and Accuracy Rivals SEM
Feed Forward Modeling and Control on a Contact Masking Process
Soft Defect Printability: Correlation to Optical Flux-Area Measurements
The End of Thresholds: Subwavelength Optical Linewidth Measurement Using the Flux-Area Technique
Defect Printability Measurement in the KLA-351: Correlation to Defect Sizing Using the AVI Metrology System
Optical Measurement of Sub-0.5 Micron Defects and CDs
Accurate and Repeatable Mask Defect Measurements for Quarter-Micron Technology
ADDS and PDMS Presentations
Slide Show. Requires Microsoft Power Point or Power Point Viewer (available from the Microsoft web site: search for "PowerPoint Viewer 97").
Patents and Products
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Automated Visual Inspection has produced PC-based image processing systems since 1984.
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